• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for producing a circuit carrier (1) equipped with at least one surface-mounted LED (SMD LED), the at least one SMD LED (2) being oriented at one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a borrow-emitting region (4) of the at least one SMD LED (2) in the SMD LED (2) is optically detected and the at least one SMD LED (2) on the circuit carrier (1). in dependence on the detected position of the borrowing emitting region (4) of the at least one SMD LED (2) is mounted and such a circuit carrier (1).
    公开号:AT513747A4
    申请号:T155/2013
    申请日:2013-02-28
    公开日:2014-07-15
    发明作者:Andreas Karch
    申请人:Mikroelektronik Ges Mit Beschränkter Haftung Ab；
    IPC主号:
    专利说明:

    • · 73552 36 / fr
    • · · · · · J
    The present invention relates to a method for producing a circuit carrier equipped with at least one surface-mounted LED (SMD LED) having the features of the preamble of claim 1 and to a circuit carrier having the features of the preamble of claim 10.
    For the realization of light-optical applications based on surface-mounted LED components (SMD-LED), a highly precise mounting of the SMD-LED components on a circuit carrier is required. Examples are headlights, daytime running lights, turn signals, cornering lights of motor vehicles whose light sources are LED.
    In this case, the SMD LEDs are to be mounted in position relative to one or more defined reference points of the circuit carrier, to which reference points an optical system (for example attachment lenses) can then be aligned. SMD-LED components have hitherto been used in the so-called "Pick & Place "method placed on the circuit boards and then soldered in the" reflow "method. In this case, the final position of the light-emitting area of the LED is determined by the following factors: the tolerances in the LED component (eg position of the light-emitting area to the outer contour of the LED or to the position of the connection pads of the LED), the tolerances in the circuit carrier, which Determine the position of the solder pads (eg track position to contour of the circuit carrier and / or a borehole, position of the solder mask to a track layer position), - the movement of the SMD LED in the reflow soldering process, caused by the slumping of the solder paste in the preheating zone and the wetting forces of the solder during melting in the peak zone (floating).
    The final positioning accuracies of the light-emitting region of SMD-LED components which can be achieved with this method are only apparent when considering the tolerances of the SMD LED and of the circuit carrier (still without any tolerances.) · · · · · · · · · ► ► ► ► · · · · · · · · · · · · · · · · 4> 4 ·· 44 73552 36 / fr
    Considering the influence of the reflow soldering process) already at more than +/- 110pm.
    The effects of the reflow soldering process create additional positional inaccuracies, especially in the area of angular and tilt positional fidelity of SMD LED devices.
    Application of the SMD LED by means of common silver sintering processes is ruled out since these processes are associated with unacceptably long process times of more than 10 seconds.
    The object of the invention is to provide a generic method with which the inevitable existing tolerances in the SMD LED and the circuit boards can be compensated, in particular a higher accuracy in positioning and mounting of SMD LED can be achieved on circuit boards and the provision of a corresponding equipped circuit carrier.
    This object is achieved by a method having the features of claim 1 and a circuit carrier having the features of claim 10.
    By mounting the at least one SMD LED on the circuit carrier in dependence on the position of the light emitting area in the SMD LED, it is possible to eliminate those inaccuracies, which go back to tolerances in the LED device and in the circuit board. As a result, tolerances in the positioning of the SMD LED on the circuit board of less than +/- 100 pm can be achieved. Applicant's experiments have shown that even tolerances of less than or equal to +/- 50 pm can be achieved.
    In other words, it is possible by the inventive method to largely or even completely turn off the component-immanent tolerances of SMD LED and circuit carrier. That is, the achievable tolerances in the method according to the invention are essentially only more due to the precision of the detection method used for the light-emitting region of the SMD. ········· ·· · LED limited. Depending on the project requirements, therefore, a sufficiently precise detection method can be selected independently of the structure of the SMD LED and the circuit substrate, thereby achieving the realization of the tolerances prescribed in the project. In other words, the larger tolerances of cheaper or simpler components can be compensated for by the use of a more precise detection method. A more accurate detection method can be achieved by using a more accurate optical camera and / or a more accurate "pick & place". Place "device is used.
    The detection of the light-emitting region of the at least one SMD LED can be effected, for example, by the use of an optical camera which recognizes the characteristic contour of the light-emitting region.
    Advantageous embodiments of the invention are defined in the dependent claims.
    The invention can be used, for example, in circuit boards which are used for headlights, daytime running lights, turn signals, cornering lights of motor vehicles whose light sources are LED.
    The reference point or the reference points may be formed, for example, in the form of holes (round or oblong holes). Additionally or alternatively, etched or printed structures may be used.
    For example, provision may be made for the SMD LED to be mounted on the circuit carrier as a function of the position of the center of the light-emitting region of the SMD LED. This is particularly advantageous because the orientation of a usually arranged in the beam path of the SMD LED optical system with respect to the center of the light-emitting area of the SMD LED.
    It is particularly preferred that at least one of the reference points for positioning and - preferably for fixing - an optical system for the 73552 36 / for SMD LED is used. In the prior art, the circuit carrier equipped with the SMD LED must be aligned relative to the optical system in a separate process step during assembly. This can be dispensed with in the particularly preferred embodiment described, since the use of at least one of the reference points for positioning the optical system already aligns it correctly. If the at least one reference point is used not only for positioning the optical system but also for fixing the optical system to the circuit carrier (in this case, the at least one reference point is for example designed as a mounting hole for the optical system), the highest accuracy results. In some applications, it may be acceptable to provide separate optical system mounting locations that are aligned with respect to the at least one reference point.
    In order to be able to orient the at least one SMD LED later at the reference point (s) of the circuit carrier, the position of the reference points of the circuit carrier must be detected. This can be done, for example, such that an optical camera departs existing reference points and in each case determines the deviation from the desired position, which results from the component-inherent tolerance. Preferably, the location of those reference points is used, which are also used later for positioning an optical system for the SMD LED. Conventionally, SMD LEDs are provided in a feed belt, from which they are formed from pockets arranged in the feed belt by means of a prior art »Pick & Place "systems are removed, for example, using a vacuum cleaner (vacuum pipette). In the prior art, the contours of the SMD LED or the position of the connection pads are detected after removal from the feed belt from the bottom. This is not possible with the invention, since the position of the light-emitting region situated on the upper side of the SMD LED is decisive here. When using a vacuum pipette system, therefore, the detection of the light-emitting area must be carried out prior to contacting by the sucker. With differently provided SMD LED this requirement does not necessarily have to be given. 5.17
    5 · 73552 36 / fr • ·····
    When using a vacuum pipette system, the invention can be carried out as follows:
    By means of a camera, which is positioned or can be moved in such a position that it can look into the individual pockets of the feed belt, the position of the light-emitting area of the SMD LED to be removed is detected. Preferably, the detected position is compared with a target position of the SMD LED in the pocket in which the SMD LED is centered in the pocket in the running direction of the feed belt (Y direction, X direction = direction perpendicular to the Y direction in the Level of Zuführgurtes) would be arranged. Deviations of the detected position of the light emitting area from the target position with respect to the X and Y directions of the center of the light emitting area and the angular position of the light emitting area are calculated. In other words, the random position of the SMD LED in the pocket of the feed belt is determined and compared with the target position.
    The detection of the position of the light-emitting region can be made more robust by illuminating the SMD LED with a light source having a wavelength adapted to the LED spectrum. Thereby, the contrast between the light emitting area and the remaining area of the SMD LED can be increased. The adjusted wavelength may be, for example, in a range of 400 to 500 nm, preferably in a range of 420 to 490 nm.
    This random position should not be changed when removing it from the bag by the vacuum pipette. In order to ensure this, it may be advantageous to also determine the Z position (Z direction = perpendicular to the X and Y direction) of the light-emitting region or of the SMD LED, since then the contact with the vacuum pipette can take place so smoothly, that there is no change in position of the SMD LED in the pocket during contacting.
    Since the position of the circuit carrier is known by determining the position of the reference points, the vacuum pipette can be controlled using the determined deviation of the light-emitting region of the SMD LED so that they are perpendicular in the X and Y direction as well as by a rotation about an axis to SMD LED 6/17 73552 36 / fr • »• · · · · · ··········································································································································································································· the SMD LED is oriented in the correct position relative to the light-emitting area. Tilting of the SMD LED need not be taken into account as it can not have an angle due to the attachment to the vacuum pipette to the axis of the vacuum pipette.
    In the following, two alternative methods are described with which correct position oriented SMD LEDs can be mounted in the correct position on the circuit carrier:
    In the first method for mounting the at least one SMD LED on the circuit carrier silver sintered material is arranged on the at least one SMD LED after orientation and at least one SMD LED silver-sintered.
    Preferably, the circuit carrier to be populated and / or the SMD LED is brought to a temperature at which the sintered material is sintered during and by the pressing of the SMD LED provided with sintered material.
    In order to allow a sufficiently short process time, the particle size of the silver sintered material should be less than about 100 nm, preferably less than about 60 nm. This achieves sintering within a contact time of less than 1 to 5 seconds after the start of pressing. For example, a sintered material having a particle size in a range of about 20 nm to about 40 nm may be used. Silver sintered material in the desired particle size can be purchased from different suppliers.
    The placement of the silver sintered material on the SMD LED may be accomplished, for example, by applying a paste of silver sintered material and a suitable organic release agent to the SMD LED.
    The paste can be made, for example, without changing the position of the SMD LED relative to the vacuum pipette by immersing the connection pads in a prepared depot of paste. 7/17 ·························································································································································································
    Alternatively, the silver sintered material may be applied to the SMD LED by a "transfer film" (DTF). In this case, the silver sintered material lies! in film form. Such films can be purchased commercially.
    By sintering, there can be no subsequent change in the correct orientation of the SMD LED, since the SMD LED can be held by the vacuum pipette until the sintering process is completed. A tilting of the SMD LED can not take place because they are pressed by the vacuum pipette on the surface of the circuit substrate.
    The second method for mounting the at least one SMD LED to the circuit carrier is based on a reflow soldering method.
    In this case, solder paste is applied to the circuit carrier - preferably printed. Subsequently, an adhesive is applied to the circuit carrier, preferably as a function of the detected position of the light-emitting region of the at least one SMD LED. The SMD LED is placed on the circuit carrier. Subsequently, the adhesive is at least partially cured. Then a reflow soldering of the solder paste can take place.
    By using the adhesive, floating of the SMD LED during reflow soldering can be avoided.
    Particularly preferred as adhesive is a UV-curable adhesive used. In this case, the at least partial curing of the adhesive can take place by exposure to UV light. Most preferably, a hybrid adhesive is used, which is UV and temperature-curable. This can be post-baked in the oven during soldering.
    It can be done either individually lighting each SMD LED, but preferably takes place to reduce the cycle time, a simultaneous lighting of all SMD LED. 8/17 • ··
    »· · I · · · * 8 * · w · ···· 73552 36 / fr
    Further advantages and details of the invention will become apparent from the figures and the associated description of the figures. In all figures, like reference numerals are used for like components.
    FIGS. 1 to 3 show test layouts which serve to check the positional accuracy of each individual SMD LED 2. The circuit carrier 1 has electrically conductive surfaces 5, which are isolated from each other by isolation regions 6. About terminals 7, the conductive surfaces 5 can be supplied with electrical energy.
    FIG. 1 shows a circuit carrier 1 which is equipped with six SMD LEDs 2. Evident are two reference points 3, which serve on the one hand to determine the deviation of the target positions for the SMD LED 2 on the circuit substrate 1 and on the other hand also used for attachment of an optical system, not shown, for the SMD LED 2. The orientation of the optical system via separate reference points, which are not shown in this figure.
    The assembly was made in Figure 1 with a "pick & Place "and reflow soldering according to the prior art. As such, the SMD LEDs 2 are oriented relative to the reference points 3 on the basis of their outer contours. The reflow soldering process has caused the SMD LED 2 to blur, so that there is no longer any orderly alignment of the outer contours of the SMD LED 2. An orientation with respect to the light emitting areas 4 of the SMD LED 2 has not occurred at all.
    FIG. 2 shows a circuit carrier 1 populated with six SMD LEDs 2, the difference to FIG. 1 being that the SMD LEDs 2 are mounted in the correct position with respect to the outer contour on the circuit carrier 1, but no mounting as a function of the light-emitting regions 4 of the SMD LED 2 is done. Also, this circuit substrate 1 does not meet the requirements with respect to the positional accuracy of the light-emitting regions 4th
    On the other hand, FIG. 3 shows an embodiment of the invention in which the SMD LED 2 is in the correct position relative to its light-emitting regions 4 relative to the light-emitting regions 4.
    Reference points 3 of the circuit substrate 1 were mounted on the circuit substrate 1. This circuit carrier 1 fulfills the requirements with regard to the positional accuracy of the light-emitting regions 4.
    FIG. 4 shows a method according to the invention comprising the steps of determining the deviation from the nominal position in the X direction and the Y direction of the reference point 3 i for all reference points 3 i (FIG. 4 a) determining the deviation from the nominal position in the Χ, Υ direction and an angular position of the light emitting region 4 of the SMD LED 2 to be removed and in the Z direction of the SMD LED 2 to be removed (FIG. 4 b) - mounting of the SMD LED 2 on the circuit carrier 1 in the correct position to the reference points 3 i of the circuit carrier 1 (FIG 4c).
    Innsbruck, on February 27, 2013
    权利要求:
    Claims (6)
    [1]
    ......... 73552 36 / fr • · · · · · · · · · · · · · · · · · · · · · · 1. A method for producing a circuit carrier (1) equipped with at least one surface-mounted LED (SMD LED), wherein the at least one SMD LED ( 2) oriented at one or more reference points (3) of the circuit carrier (1) is positioned on the circuit carrier (1), characterized in that the position of a light-emitting region (4) of the at least one SMD LED (2) in the SMD LED (2) is optically detected and the at least one SMD LED (2) on the circuit carrier (1) in dependence on the detected position of the light emitting area (4) of the at least one SMD LED (2) is mounted.
    [2]
    2. The method according to claim 1, characterized in that the position of the light emitting area (4) in all three dimensions (X, Y, Z) and the angular position relative to a rotation axis at right angles to the plane of the SMD LED (2) is determined.
    [3]
    3. The method according to claim 1 or 2, characterized in that the mounting of the at least one SMD LED (2) on the circuit carrier (1) in dependence on the position of the center of the light emitting area (4) of the at least one SMD LED (2 ) he follows.
    [4]
    4. The method according to at least one of claims 1 to 3, characterized in that at least one of the reference points (3) for positioning and - preferably for fixing - an optical system for the at least one SMD LED (2) is used.
    [5]
    5. The method according to at least one of claims 1 to 4, characterized in that the SMD LED (2) is illuminated with a wavelength adapted to the LED spectrum having light source.
    [6]
    6. The method according to at least one of claims 1 to 5, characterized in that for mounting the at least one SMD LED (2) on the circuit carrier (1) silver sintered material on the at least one SMD LED 11/17
    类似技术:
    公开号 | 公开日 | 专利标题
    AT513747B1|2014-07-15|Assembly process for circuit carriers and circuit carriers
    WO2016094913A1|2016-06-23|Method for producing a circuit carrier, and circuit carrier
    EP2915698A1|2015-09-09|Led light
    AT515071B1|2019-03-15|Method for positionally stable soldering
    EP3308615B1|2020-05-13|Method for accurately populating a circuit carrier
    EP3321570B1|2021-12-22|Method for arranging a circuit carrier and lighting device for a motor vehicle with a circuit carrier arranged according to this method
    WO2016113225A1|2016-07-21|Method for placing an smd semiconductor light source component of an illumination device for a motor vehicle
    DE102014101783A1|2015-08-13|Method for constructing an LED light module
    EP2976880A1|2016-01-27|Stereo camera module and method for the production thereof
    AT514599B1|2015-02-15|Method for equipping electronic circuit boards with optical components
    DE102014210654A1|2015-12-17|Method for applying an SMD semiconductor light source component to a printed circuit board
    EP2983458A1|2016-02-10|Method for fixing a smd semiconductor light source on a circuit board of a headlight of a vehicle
    DE102004039192B3|2006-01-26|Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool
    DE102015201998A1|2016-08-11|Camera module and method of manufacture
    DE102012106982A1|2014-02-06|Process for the production of a light source
    EP3030055B1|2019-03-27|Method for producing a component of a lighting device for a motor vehicle
    WO2016176702A1|2016-11-10|Method for positioning at least one electronic component on a circuit board
    DE102014005298A1|2014-09-25|Method for the production of a light source, illuminant and lighting system
    DE102016223710B4|2021-01-14|Method and device for producing a lighting device
    DE102015012825A1|2016-04-28|Method for equipping an already equipped printed circuit board
    DE10162270A1|2003-07-10|Optical sensor device
    DE102016102637A1|2017-08-17|Method for producing a light module of a motor vehicle lighting device and light module
    DE102015116563A1|2017-03-30|Method for producing electronic components for sensors of a motor vehicle
    WO2015036505A1|2015-03-19|Optoelectronic component and method for the production thereof
    WO2017129619A1|2017-08-03|Method for machining a holding device for a light module of a lighting device of a motor vehicle
    同族专利:
    公开号 | 公开日
    TWI684388B|2020-02-01|
    AT513747B1|2014-07-15|
    TW201448680A|2014-12-16|
    EP2807905A1|2014-12-03|
    US20150364384A1|2015-12-17|
    US10672672B2|2020-06-02|
    US20190189526A1|2019-06-20|
    JP2015517222A|2015-06-18|
    DE212014000002U1|2014-11-19|
    KR101556492B1|2015-10-01|
    US20200294867A1|2020-09-17|
    PT2807905E|2016-03-22|
    WO2014153576A1|2014-10-02|
    JP2016181723A|2016-10-13|
    CN104488366A|2015-04-01|
    EP2807905B1|2015-11-18|
    JP2018142737A|2018-09-13|
    KR20150013850A|2015-02-05|
    CN108882514A|2018-11-23|
    ES2559478T3|2016-02-12|
    HUE026677T2|2016-06-28|
    US10991632B2|2021-04-27|
    US10217675B2|2019-02-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS55100514A|1979-01-26|1980-07-31|Nippon Telegr & Teleph Corp <Ntt>|Optical communication apparatus|
    US20090090002A1|2007-10-05|2009-04-09|Sony Corporation|Method of manufacturing an electronic component substrate|
    US20090189949A1|2008-01-29|2009-07-30|Ming-Che Wu|Method for arranging print head chips|
    EP2112534A1|2008-04-24|2009-10-28|Nitto Denko Corporation|Manufacturing method of opto-electric hybrid board|
    US20100053929A1|2008-08-26|2010-03-04|Jeffrey Bisberg|LED Packaging Methods And LED-Based Lighting Products|
    KR20100108969A|2009-03-31|2010-10-08|서울반도체 주식회사|Method for fabricating light emitting diode packang and light emitting diode package|
    WO2012057038A1|2010-10-26|2012-05-03|東芝ライテック株式会社|Light-emitting module and lighting equipment|
    KR20110060868A|2011-01-25|2011-06-08|삼성엘이디 주식회사|Heat sink board and manufacturing method thereof, light emitting diode package module having the same and manufacturing method thereof|DE102015200393A1|2015-01-14|2016-07-14|Automotive Lighting Reutlingen Gmbh|Method for arranging an SMD semiconductor light source component of a lighting device of a motor vehicle|
    DE102016108260A1|2016-05-04|2017-11-09|Automotive Lighting Reutlingen Gmbh|Method for arranging a circuit carrier and device for arranging a circuit carrier|
    DE102016119792A1|2016-10-18|2018-04-19|Automotive Lighting Reutlingen Gmbh|Method for arranging a circuit carrier and illumination device for a motor vehicle with a circuit carrier arranged according to this method|
    DE102016223710A1|2016-11-29|2018-05-30|Carl Zeiss Industrielle Messtechnik Gmbh|Method and device for producing a lighting device|JPS5741117B2|1978-02-08|1982-09-01|
    JPS6012786A|1983-07-01|1985-01-23|Hitachi Ltd|Manufacture of light emitting device|
    DE3474750D1|1983-11-05|1988-11-24|Zevatech Ag|Method and device positioning elements on a work piece|
    JPH0357168B2|1983-12-05|1991-08-30|
    DE3445625A1|1984-12-14|1986-06-26|Pulsotronic Merten Gmbh & Co Kg, 5270 Gummersbach|Method for soldering a printed-circuit board which is fitted with SMD components on both sides, and a board which is soldered in accordance with this method|
    US4772123A|1986-11-24|1988-09-20|American Telephone And Telegraph Company, At&T Bell Laboratories|Alignment of optical components|
    DE3827151A1|1988-01-11|1989-07-20|Martin Bernhard Dipl Ing Fh|DEVICE FOR ADDING ADHESIVE|
    JPH01209578A|1988-02-16|1989-08-23|Nec Corp|Mounting device for led array chip|
    DE3806738C1|1988-03-02|1989-09-07|Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De|
    JP2679849B2|1989-07-26|1997-11-19|松下電器産業株式会社|Electronic component mounting method and adhesive used in this method|
    US4980971A|1989-12-14|1991-01-01|At&T Bell Laboratories|Method and apparatus for chip placement|
    US5173759A|1990-02-06|1992-12-22|Kyocera Corporation|Array of light emitting devices or photo detectors with marker regions|
    US5290986A|1991-10-22|1994-03-01|International Business Machines Corporation|Thermally assisted shorts removal process for glass ceramic product using an RF field|
    JP3232628B2|1992-03-13|2001-11-26|松下電器産業株式会社|Electronic component mounting method|
    JPH0624040A|1992-07-07|1994-02-01|Oki Electric Ind Co Ltd|Recognition of led array reference pattern and detection of position of led array using the recognition|
    DE69426090T2|1993-04-27|2001-03-01|Nec Corp|Method of manufacturing an optical semiconductor device|
    JP2797958B2|1993-04-27|1998-09-17|日本電気株式会社|Optical semiconductor device bonding structure and bonding method|
    JPH06349892A|1993-06-10|1994-12-22|Matsushita Electric Ind Co Ltd|Manufacture of semiconductor device|
    US5559727A|1994-02-24|1996-09-24|Quad Systems Corporation|Apparatus and method for determining the position of a component prior to placement|
    DE59611448D1|1995-09-11|2007-12-06|Infineon Technologies Ag|Method for mounting electronic components on a substrate by pressure sintering|
    US5758942A|1995-12-18|1998-06-02|Micron Technology, Inc.|Mechanical vision system using selective wavelength and brightness illumination|
    JP3258221B2|1995-12-26|2002-02-18|沖電気工業株式会社|Recognition mark for alignment and method of forming the same, mask for forming recognition mark and light emitting portion, alignment method using recognition mark for alignment|
    DE69724894T2|1996-03-27|2004-07-08|Assembleon N.V.|ASSEMBLY METHOD OF COMPONENTS ON A SUBSTRATE AND ASSEMBLY MACHINE THEREFOR|
    US5857767A|1996-09-23|1999-01-12|Relume Corporation|Thermal management system for L.E.D. arrays|
    US6809421B1|1996-12-02|2004-10-26|Kabushiki Kaisha Toshiba|Multichip semiconductor device, chip therefor and method of formation thereof|
    DE19711138C2|1997-03-07|1998-12-17|Siemens Ag|Manufacturing process for an electro-optical module|
    WO1999017599A1|1997-09-30|1999-04-08|Siemens Aktiengesellschaft|Method and device for recognizing the position of connections and/or edges of components|
    US6480223B1|1997-09-30|2002-11-12|Siemens Aktiengesellschaft|Method and device for detecting the position of terminals and/or edge of components|
    US6040895A|1997-10-08|2000-03-21|Siemens Aktiengesellschaft|Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object|
    US6359694B1|1997-11-10|2002-03-19|Siemens Aktiengesellschaft|Method and device for identifying the position of an electrical component or terminals thereof, and equipping head employing same|
    JP3668383B2|1998-02-27|2005-07-06|松下電器産業株式会社|Electronic component mounting equipment|
    JP2000022396A|1998-06-30|2000-01-21|Sony Corp|Electronic component mounting apparatus|
    JP3678007B2|1998-07-10|2005-08-03|松下電器産業株式会社|Electronic component recognition apparatus and electronic component recognition method in electronic component mounting apparatus|
    JP2000164626A|1998-09-25|2000-06-16|Fuji Photo Film Co Ltd|Method and device for bonding components|
    EP1003212A3|1998-11-18|2003-11-19|Fuji Photo Film Co., Ltd.|Method of and apparatus for bonding light-emitting element|
    JP2000150970A|1998-11-18|2000-05-30|Fuji Photo Film Co Ltd|Light emitting device bonding method and equipment|
    JP2000183404A|1998-12-14|2000-06-30|Fuji Photo Film Co Ltd|Light emitting element array and method and apparatus for bonding it|
    DE19859669A1|1998-12-23|2000-06-29|Heidenhain Gmbh Dr Johannes|Integrated optoelectronic sensor and method for its production|
    JP4328409B2|1999-04-12|2009-09-09|富士フイルム株式会社|Light emitting device bonding equipment|
    WO2001065904A1|2000-03-01|2001-09-07|Siemens Aktiengesellschaft|Method and device for determining the pick-up position of electrical components in a component placement device|
    JP2002139451A|2000-08-04|2002-05-17|Nikon Corp|Surface inspection apparatus|
    JP2002365019A|2001-06-06|2002-12-18|Fujitsu Ltd|Detector of luminous point position of light emitting device|
    US6576488B2|2001-06-11|2003-06-10|Lumileds Lighting U.S., Llc|Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor|
    DE10128476C2|2001-06-12|2003-06-12|Siemens Dematic Ag|Optical sensor device for the visual detection of substrates|
    DE10129743C2|2001-06-20|2003-05-08|Daimler Chrysler Ag|Vehicle headlight, with a number of electronic lighting elements as the light source|
    JP2003110245A|2001-09-28|2003-04-11|Ibiden Co Ltd|Substrate for packaging optic element and manufacturing method thereof, and optic element|
    JP2003152260A|2001-11-09|2003-05-23|Sharp Corp|Semiconductor laser device, optical pickup device using the same, and method and device for manufacturing semiconductor laser device|
    DE10162270B4|2001-12-18|2004-05-13|Siemens Ag|Optical sensor device|
    JP2003298294A|2002-04-03|2003-10-17|Fuji Mach Mfg Co Ltd|Electronic circuit component mounting system|
    US7016525B2|2002-05-02|2006-03-21|Mitutoyo Corporation|Systems and methods for continuously varying wavelength illumination|
    US8093144B2|2002-05-24|2012-01-10|Massachusetts Institute Of Technology|Patterning of nanostructures|
    JP3657930B2|2002-07-05|2005-06-08|パイオニアプラズマディスプレイ株式会社|Plasma display panel manufacturing method, phosphor layer inspection method, and phosphor layer inspection apparatus|
    US8100552B2|2002-07-12|2012-01-24|Yechezkal Evan Spero|Multiple light-source illuminating system|
    US9955551B2|2002-07-12|2018-04-24|Yechezkal Evan Spero|Detector controlled illuminating system|
    JP2004079750A|2002-08-16|2004-03-11|Fuji Photo Film Co Ltd|Light emitting device|
    JP4357168B2|2002-11-20|2009-11-04|株式会社東芝|Measuring method, measuring apparatus, and mounting apparatus for light emitting point position of laser diode|
    US7084353B1|2002-12-11|2006-08-01|Emc Corporation|Techniques for mounting a circuit board component to a circuit board|
    JP2004207655A|2002-12-26|2004-07-22|Matsushita Electric Ind Co Ltd|Metallic base substrate and light-emitting unit|
    JP4106301B2|2003-04-23|2008-06-25|Ｊｕｋｉ株式会社|Component recognition method and apparatus|
    DE50306813D1|2003-05-19|2007-04-26|Fraunhofer Ges Forschung|OPTOELECTRONIC COMPONENT WITH ONE LIGHTING DIODE AND A MULTIPLE OF LIGHT SENSORS|
    JP4356383B2|2003-07-03|2009-11-04|パナソニック電工株式会社|Method for manufacturing light emitting device|
    JP2005064303A|2003-08-15|2005-03-10|Sony Corp|Opto-electric compound substrate apparatus and method of manufacturing the same|
    WO2005029658A1|2003-09-22|2005-03-31|Murata Manufacturing Co., Ltd.|Method and device for installing light emitting element|
    JP4792726B2|2003-10-30|2011-10-12|日亜化学工業株式会社|Manufacturing method of support for semiconductor element|
    JP4047266B2|2003-11-19|2008-02-13|株式会社小糸製作所|Lamp|
    US7688309B2|2004-07-06|2010-03-30|Logitech Europe S.A.|Optical displacement module and method to reduce the size of an optical pointing device thereof|
    JP5122062B2|2004-09-22|2013-01-16|株式会社光波|Light emitting device|
    DE102004056252A1|2004-10-29|2006-05-04|Osram Opto Semiconductors Gmbh|Lighting device, vehicle headlight and method for producing a lighting device|
    JP2006138679A|2004-11-10|2006-06-01|Matsushita Electric Ind Co Ltd|Substrate shape detector, and apparatus and method for mounting device using the detector|
    JP4443397B2|2004-12-13|2010-03-31|シチズン電子株式会社|Optical semiconductor element, optical semiconductor device, and method of manufacturing optical semiconductor element|
    DE112005002889B4|2004-12-14|2015-07-23|Seoul Viosys Co., Ltd.|Light emitting device with a plurality of light emitting cells and assembly assembly thereof|
    EP1675453A3|2004-12-22|2007-07-11|Siemens Aktiengesellschaft|Device for illuminating objects and sensor device|
    US7600220B2|2005-01-11|2009-10-06|Worksoft, Inc.|Extensible execution language|
    US20080186725A1|2005-01-28|2008-08-07|Koninklijke Philips Electronics, N.V.|Headlamp For Vehicles|
    DE102005005896B4|2005-02-09|2011-01-13|Siemens Electronics Assembly Systems Gmbh & Co. Kg|Use of a lighting device in a placement machine|
    DE102005009317B4|2005-02-18|2007-05-31|Atmel Germany Gmbh|Method and device for determining a laser threshold of a laser diode|
    CN102585810A|2005-02-28|2012-07-18|电气化学工业株式会社|Fluorescent substance and process for producing the same, and luminescent element using the same|
    EP2280430B1|2005-03-11|2020-01-01|Seoul Semiconductor Co., Ltd.|LED package having an array of light emitting cells coupled in series|
    US20060211240A1|2005-03-18|2006-09-21|Taiwan Semiconductor Manufacturing Co., Ltd.|Method of enhancing adhesion between dielectric layers|
    KR100702969B1|2005-04-19|2007-04-03|삼성전자주식회사|Board mounting structure of bga type semiconductor chip package having dummy solder ball|
    JP2006310653A|2005-04-28|2006-11-09|Toyoda Gosei Co Ltd|Led lamp and method of mounting substrate mounted component|
    US7429786B2|2005-04-29|2008-09-30|Stats Chippac Ltd.|Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides|
    JP2007087608A|2005-09-20|2007-04-05|Sharp Corp|Light source device and display device|
    WO2007054868A2|2005-11-09|2007-05-18|Philips Intellectual Property & Standards Gmbh|Assembling lighting elements onto a substrate|
    US20070187818A1|2006-02-15|2007-08-16|Texas Instruments Incorporated|Package on package design a combination of laminate and tape substrate|
    US7829899B2|2006-05-03|2010-11-09|Cree, Inc.|Multi-element LED lamp package|
    KR101204573B1|2006-05-10|2012-11-26|덴끼 가가꾸 고교 가부시키가이샤|Sialon phosphor, process for producing the same, and illuminator and luminescent element employing the same|
    US8735920B2|2006-07-31|2014-05-27|Cree, Inc.|Light emitting diode package with optical element|
    AT504577B1|2006-11-24|2009-06-15|Zizala Lichtsysteme Gmbh|LED LIGHT SOURCE SYSTEM|
    JP2008145300A|2006-12-11|2008-06-26|Sharp Corp|Phosphor layer thickness determination method and manufacturing method of light-emitting device|
    JP5151150B2|2006-12-28|2013-02-27|株式会社日立製作所|Composition for forming conductive sintered layer, and method for forming conductive film and bonding method using the same|
    JP4895994B2|2006-12-28|2012-03-14|株式会社日立製作所|Joining method and joining material using metal particles|
    JP5380774B2|2006-12-28|2014-01-08|日亜化学工業株式会社|Surface mount type side surface light emitting device and manufacturing method thereof|
    DE102007015492B4|2007-01-30|2011-03-24|Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.|Illumination device for an image capture device at the distal end of an endoscope|
    WO2008124397A1|2007-04-03|2008-10-16|David Fishbaine|Inspection system and method|
    CN101755030B|2007-05-22|2014-05-14|独立行政法人物质·材料研究机构|Fluorescent substance, method for production of same, and light-emitting device using same|
    US7638814B2|2007-06-19|2009-12-29|Philips Lumileds Lighting Company, Llc|Solderless integrated package connector and heat sink for LED|
    TWM324300U|2007-06-29|2007-12-21|Chia-Ming Tu|Translucent LED array display device|
    DE102007037822A1|2007-08-10|2009-02-12|Osram Gesellschaft mit beschränkter Haftung|lighting device|
    JP4883181B2|2007-08-17|2012-02-22|富士通株式会社|Component mounting method|
    US8359734B2|2007-09-05|2013-01-29|Cisco Technology, Inc.|Alignment jig for electronic component|
    WO2009031903A1|2007-09-05|2009-03-12|Tandberg Telecom As|Device and method for mounting an electronic component|
    WO2009047810A1|2007-09-07|2009-04-16|Datalogic Scanning Group S.R.L.|Image acquisition device and optical component thereof|
    JP5301548B2|2007-09-20|2013-09-25|コーニンクレッカフィリップスエレクトロニクスエヌヴィ|LED package and method for manufacturing the LED package|
    JP5017040B2|2007-09-27|2012-09-05|三菱レイヨン株式会社|Preform manufacturing method and manufacturing apparatus|
    US7524087B1|2007-11-16|2009-04-28|Avago Technologies Ecbu Ip Pte. Ltd.|Optical device|
    CN100552831C|2008-02-27|2009-10-21|中南大学|Based semiconductor chip attach low-temperature sintering type conductive slurry and preparation technology thereof|
    US8742558B2|2008-05-21|2014-06-03|General Electric Company|Component protection for advanced packaging applications|
    KR100990641B1|2008-06-04|2010-10-29|삼성엘이디 주식회사|Apparatus for testing led, and its method|
    JP2010010437A|2008-06-27|2010-01-14|Stanley Electric Co Ltd|Optical semiconductor device|
    JP2010044967A|2008-08-13|2010-02-25|Sumitomo Electric Ind Ltd|Conductive adhesive and led substrate using it|
    WO2010146902A1|2009-06-15|2010-12-23|シャープ株式会社|Light emitting module, illuminating device, display device, and television receiving device|
    WO2011003948A2|2009-07-08|2011-01-13|Henkel Ag & Co. Kgaa|Electrically conductive adhesives|
    KR101047151B1|2009-07-13|2011-07-07|한국과학기술원|Group cooperative transmission method in ad hoc network|
    JP2011040247A|2009-08-10|2011-02-24|Koito Mfg Co Ltd|Lamp unit of headlight for vehicle|
    DE102009028499A1|2009-08-13|2011-02-17|Endress + Hauser Gmbh + Co. Kg|Mixedly assembled printed circuit boards assembling and soldering method, involves inserting connection pins of through-hole-technique-components into solderable clamping devices and soldering connection pins|
    JP5258707B2|2009-08-26|2013-08-07|株式会社東芝|Semiconductor light emitting device|
    KR101131605B1|2009-12-02|2012-05-24|엔브이에이치코리아|A height acoustic-absorptivity headliner for vehicle|
    CN201629347U|2010-02-01|2010-11-10|常州欧密格光电科技有限公司|Sticky LED|
    US8901583B2|2010-04-12|2014-12-02|Cree Huizhou Opto Limited|Surface mount device thin package|
    WO2011139764A2|2010-04-27|2011-11-10|Cooper Technologies Company|Linkable linear light emitting diode system|
    WO2011139768A2|2010-04-28|2011-11-10|Cooper Technologies Company|Linear led light module|
    DE102010028949A1|2010-05-12|2011-11-17|Osram Gesellschaft mit beschränkter Haftung|headlight module|
    TWM393806U|2010-05-31|2010-12-01|Hon Hai Prec Ind Co Ltd|Light emitting diode lead frame|
    JP5701523B2|2010-06-22|2015-04-15|日東電工株式会社|Semiconductor light emitting device|
    DE102010031939B4|2010-07-22|2012-05-24|Asm Assembly Systems Gmbh & Co. Kg|Dispenser system for a placement machine, placement machine and method for applying a dispensing medium to components|
    DE102010038405A1|2010-07-26|2012-01-26|Osram Opto Semiconductors Gmbh|Electronic component and method for producing an electronic component|
    JP5338772B2|2010-08-26|2013-11-13|パナソニック株式会社|Component mounting apparatus, imaging illumination apparatus, and illumination method|
    JP5526452B2|2010-09-10|2014-06-18|スタンレー電気株式会社|Vehicle lamp unit|
    JP5434884B2|2010-10-27|2014-03-05|パナソニック株式会社|Electronic component mounting apparatus and electronic component mounting method|
    US20120202300A1|2011-02-03|2012-08-09|Texas Instruments Incorporated|Die bonder including automatic bond line thickness measurement|
    JP4940363B1|2011-02-28|2012-05-30|株式会社東芝|Semiconductor light emitting device and semiconductor light emitting device|
    JP5810553B2|2011-02-28|2015-11-11|三菱マテリアル株式会社|Laminate for bonding and bonded body|
    WO2012116470A1|2011-03-02|2012-09-07|Cree Huizhou Solid State Lighting Company Limited|Miniature surface mount device|
    JP5658600B2|2011-03-07|2015-01-28|スタンレー電気株式会社|Light emitting device|
    WO2012128094A1|2011-03-18|2012-09-27|シャープ株式会社|Method for securing light-emitting device and light-emitting device|
    KR101856533B1|2011-03-28|2018-05-14|삼성전자주식회사|Apparatus for inspecting light emitting device and inspecting method using the same|
    JP2012238411A|2011-05-10|2012-12-06|Panasonic Corp|Method for manufacturing led illumination substrate|
    JP2012238410A|2011-05-10|2012-12-06|Panasonic Corp|Method for manufacturing led illumination substrate|
    JP2012248708A|2011-05-27|2012-12-13|Ccs Inc|Led package and manufacturing method of led package|
    US8546900B2|2011-06-09|2013-10-01|Optiz, Inc.|3D integration microelectronic assembly for integrated circuit devices|
    KR20130000689A|2011-06-23|2013-01-03|주식회사 케이티|Cable installing apparatus|
    KR101248143B1|2011-06-24|2013-03-28|주식회사 에스에프이|Image processing module and led chip bonding apparatus using thereof|
    KR20130006970A|2011-06-28|2013-01-18|세미머티리얼즈|Light emitting device and method for fabricating the same|
    DE102011109226A1|2011-08-02|2013-02-07|Osram Opto Semiconductors Gmbh|Method for establishing interconnection layer between e.g. ceramic carrier and LED chip, involves providing mixture with particulate sinter material and solvent, and supplying heat for fusion of sinter material in inert gas atmosphere|
    AT511761B1|2011-08-08|2014-02-15|Zizala Lichtsysteme Gmbh|LED LIGHT SOURCE MODULE FOR A VEHICLE HEADLAMP AND VEHICLE HEADLAMP AND VEHICLE LIGHT SYSTEM|
    US8780576B2|2011-09-14|2014-07-15|Invensas Corporation|Low CTE interposer|
    JP5566359B2|2011-09-29|2014-08-06|株式会社日立ハイテクインスツルメンツ|Component mounting device|
    AT512545B1|2012-02-16|2017-05-15|Zkw Group Gmbh|Status display for the state of an operationally relevant component of a motor vehicle|
    WO2013133085A1|2012-03-05|2013-09-12|ナミックス株式会社|Sintered silver microparticle compact|
    DE102012101818B4|2012-03-05|2018-11-08|Osram Opto Semiconductors Gmbh|Optoelectronic module with a coding element in a recess, illumination device with this module and method for its production|
    TW201339534A|2012-03-16|2013-10-01|Hon Hai Prec Ind Co Ltd|Place machine for LED and place system thereof|
    TWI499031B|2012-03-22|2015-09-01|Kun Hsin Technology Inc|Light emitting device|
    JP5664625B2|2012-10-09|2015-02-04|三菱マテリアル株式会社|Semiconductor device, ceramic circuit board, and semiconductor device manufacturing method|
    CN102935518B|2012-10-31|2014-08-06|哈尔滨工业大学深圳研究生院|Nano silver paste for chip mounting and method for preparing nano silver paste|
    WO2014123145A1|2013-02-08|2014-08-14|ウシオ電機株式会社|Fluorescent light source device|
    TW201511347A|2013-09-10|2015-03-16|Lingsen Precision Ind Ltd|LED package structure and manufacturing method thereof|
    DE102013018784B4|2013-11-08|2016-02-18|Audi Ag|Vehicle with lighting device with a longitudinal illumination device|
    WO2015078865A1|2013-11-28|2015-06-04|Osram Opto Semiconductors Gmbh|Component arrangement and method for producing a component arrangement|
    JP6450923B2|2013-12-20|2019-01-16|パナソニックＩｐマネジメント株式会社|Electronic component mounting system, electronic component mounting method, and electronic component mounting apparatus|
    DE102014101783B4|2014-02-13|2021-08-19|HELLA GmbH & Co. KGaA|Procedure for building an LED light module|
    DE102014101901B4|2014-02-14|2015-10-15|Asm Assembly Systems Gmbh & Co. Kg|Optical measurement of a component with structural features present on opposite sides|
    US20150311104A1|2014-04-24|2015-10-29|Avago Technologies General Ip Pte. Ltd.|Method and system for aligning and orienting dies|
    WO2015195272A1|2014-06-20|2015-12-23|Applied Materials, Inc.|Methods for reducing semiconductor substrate strain variation|
    US9666516B2|2014-12-01|2017-05-30|General Electric Company|Electronic packages and methods of making and using the same|
    US9633883B2|2015-03-20|2017-04-25|Rohinni, LLC|Apparatus for transfer of semiconductor devices|
    US9759851B2|2015-04-01|2017-09-12|Microsoft Technology Licensing, Llc|Thermal expansion compensated backlight illumination|
    US20170051884A1|2015-08-19|2017-02-23|Soraa Laser Diode, Inc.|Integrated light source using a laser diode|
    US10062588B2|2017-01-18|2018-08-28|Rohinni, LLC|Flexible support substrate for transfer of semiconductor devices|AT514599B1|2013-07-05|2015-02-15|Melecs Ews Gmbh & Co Kg|Method for equipping electronic circuit boards with optical components|
    DE102014224494A1|2014-12-01|2016-06-02|Automotive Lighting Reutlingen Gmbh|Method for producing a component of a lighting device for a motor vehicle|
    AT516638A1|2014-12-17|2016-07-15|A B Mikroelektronik Ges Mit Beschränkter Haftung|Method for producing a circuit carrier and circuit carrier|
    DE102015207709A1|2015-04-27|2016-10-27|Automotive Lighting Reutlingen Gmbh|Method and device for arranging a circuit carrier with a semiconductor light source in a specific position relative to an optical system of a lighting device|
    AT517120B1|2015-05-04|2020-01-15|Zkw Group Gmbh|METHOD FOR POSITIONING AT LEAST ONE ELECTRONIC COMPONENT ON A CIRCUIT BOARD|
    AT517259B1|2015-06-09|2020-01-15|Zkw Group Gmbh|Process for the exact placement of a circuit carrier|
    DE102016201206A1|2016-01-27|2017-07-27|Automotive Lighting Reutlingen Gmbh|Method for processing a holding device for a light module of a lighting device of a motor vehicle|
    DE102016103368A1|2016-02-25|2017-08-31|Automotive Lighting Reutlingen Gmbh|Method for producing a holding device of a light module of a motor vehicle lighting device|
    KR102240592B1|2016-12-07|2021-04-15|야마하하쓰도키 가부시키가이샤|Surface mount machine, parts recognition device, parts recognition method|
    US10765009B2|2016-12-21|2020-09-01|Lumileds Llc|Method for addressing misalignment of LEDs on a printed circuit board|
    WO2018150573A1|2017-02-20|2018-08-23|株式会社Ｆｕｊｉ|Component mounting system and component mounting method|
    EP3828940A4|2018-07-24|2021-07-28|Fuji Corporation|Component mounting method and work system|
    DE102019106910A1|2019-03-19|2020-09-24|HELLA GmbH & Co. KGaA|Method for arranging a printed circuit board on a heat sink|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA155/2013A|AT513747B1|2013-02-28|2013-02-28|Assembly process for circuit carriers and circuit carriers|ATA155/2013A| AT513747B1|2013-02-28|2013-02-28|Assembly process for circuit carriers and circuit carriers|
    EP14708789.4A| EP2807905B1|2013-02-28|2014-02-07|Placement method for circuit carrier|
    JP2015507299A| JP2015517222A|2013-02-28|2014-02-07|Circuit carrier manufacturing method and circuit carrier|
    HUE14708789A| HUE026677T2|2013-02-28|2014-02-07|Placement method for circuit carrier|
    PT147087894T| PT2807905E|2013-02-28|2014-02-07|Placement method for circuit carrier|
    CN201811040188.7A| CN108882514A|2013-02-28|2014-02-07|Method for providing and circuit carrier for circuit carrier|
    CN201480001918.6A| CN104488366A|2013-02-28|2014-02-07|Placement method for circuit carrier and circuit carrier|
    KR1020147035661A| KR101556492B1|2013-02-28|2014-02-07|Placement method for circuit carrier and circuit carrier|
    ES14708789.4T| ES2559478T3|2013-02-28|2014-02-07|Equipment procedure for circuit support|
    PCT/AT2014/000027| WO2014153576A1|2013-02-28|2014-02-07|Placement method for circuit carrier and circuit carrier|
    DE212014000002.5U| DE212014000002U1|2013-02-28|2014-02-07|circuit support|
    TW103105400A| TWI684388B|2013-02-28|2014-02-19|Method for placement on a circuit carrier and circuit carrier|
    US14/836,049| US10217675B2|2013-02-28|2015-08-26|Placement method for circuit carrier and circuit carrier|
    JP2016129642A| JP2016181723A|2013-02-28|2016-06-30|Method of manufacturing circuit carrier, and circuit carrier|
    JP2018107605A| JP2018142737A|2013-02-28|2018-06-05|Manufacturing method of circuit carrier|
    US16/262,260| US10672672B2|2013-02-28|2019-01-30|Placement method for circuit carrier and circuit carrier|
    US16/889,085| US10991632B2|2013-02-28|2020-06-01|Assembly process for circuit carrier and circuit carrier|
    [返回顶部]